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Investigation of non-symmetric contacting and voids in electrical vias produced in hybrid thick-film technology

Title data

Ortolino, Dominique ; Kita, Jaroslaw ; Wurm, Roland ; Blum, Emmanuel ; Beart, Karin ; Moos, Ralf:
Investigation of non-symmetric contacting and voids in electrical vias produced in hybrid thick-film technology.
2011
Event: 35th International Microelectronics and Packaging IMAPS Conference , 21. - 24.09.2011 , Gdansk, Poland.
(Conference item: Conference , Poster )

Project information

Project title:
Project's official titleProject's id
No informationAZ-770-07

Project financing: Bayerische Forschungsstiftung

Abstract in another language

Hybrid-thick-film circuits consist of many different components. There are screen-printed passive elements (conductors, resistors, electrical vias), SMDs and active elements like transistors or ICs. Whereas most of passive components are well investigated and described, the electrical vias remain unattended. This contribution deals with the behavior of thick-film vias when applying high currents, since resistive heating caused by a high current might lead to the destruction of the vias. In order to investigate the influence of non-radial-symmetric contacting and geometric irregularities of the vias, a 3D FEM-model was developed. The contacting of the vias was modeled including geometric irregularities (voids). Both are resulting in a non-symmetric temperature distribution T(x,t) in the via and furthermore in higher maximum temperatures after a defined current pulse. Finally, the influence of the position of geometric irregularities according to the contacting was investigated.

Further data

Item Type: Conference item (Poster)
Refereed: Yes
Institutions of the University: Faculties > Faculty of Engineering Science
Faculties > Faculty of Engineering Science > Chair Functional Materials > Chair Functional Materials - Univ.-Prof. Dr.-Ing. Ralf Moos
Faculties
Faculties > Faculty of Engineering Science > Chair Functional Materials
Profile Fields > Advanced Fields > Advanced Materials
Research Institutions > Research Centres > Bayreuth Center for Material Science and Engineering - BayMAT
Profile Fields
Profile Fields > Advanced Fields
Research Institutions
Research Institutions > Research Centres
Result of work at the UBT: Yes
DDC Subjects: 600 Technology, medicine, applied sciences > 620 Engineering
Date Deposited: 19 May 2015 09:08
Last Modified: 13 Apr 2016 07:08
URI: https://eref.uni-bayreuth.de/id/eprint/13633