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Influence of the power semiconductor packaging on the failure characteristic for safety-critical applications

Title data

Gleißner, Michael ; Bakran, Mark-M.:
Influence of the power semiconductor packaging on the failure characteristic for safety-critical applications.
2017
Event: PCIM Europe 2017 , 16.-18.05.2017 , Nürnberg, Deutschland.
(Conference item: Conference , Paper )

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Abstract in another language

The packaging of power semiconductors determines their failure characteristic. Wire-bonded modules fail with an undefined state reaching from not ideal short-circuit to explosion of the module depending on the failure energy. In contrast, an ideal short-on failure characteristic is known for presspack and sandwich structure modules. Safety critical applications like the discharging of energy sources, e.g. fuel cells, require an ideal short-on failure characteristic. A minimum failure energy is necessary to reach this ideal failure state and a maximum failure energy must not be exceeded in order to avoid severe mechanical destruction. Therefore, the failure characteristic depending on packaging and energy is investigated by destruction tests.

Further data

Item Type: Conference item (Paper)
Refereed: Yes
Institutions of the University: Faculties > Faculty of Engineering Science > Chair Mechatronics > Chair Mechatronics - Univ.-Prof. Dr.-Ing. Mark-M. Bakran
Profile Fields > Advanced Fields > Advanced Materials
Profile Fields > Emerging Fields > Energy Research and Energy Technology
Research Institutions > Research Units > ZET - Zentrum für Energietechnik
Faculties
Faculties > Faculty of Engineering Science
Faculties > Faculty of Engineering Science > Chair Mechatronics
Profile Fields
Profile Fields > Advanced Fields
Profile Fields > Emerging Fields
Research Institutions
Research Institutions > Research Units
Result of work at the UBT: Yes
DDC Subjects: 600 Technology, medicine, applied sciences > 620 Engineering
Date Deposited: 26 Jun 2017 08:51
Last Modified: 26 Jun 2017 08:51
URI: https://eref.uni-bayreuth.de/id/eprint/38124