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Submicron Contact Printing on Silicon Using Stamp Pads

Title data

Pompe, Tilo ; Fery, Andreas ; Herminghaus, Stephan ; Kriele, A ; Lorenz, H ; Kotthaus, J. P.:
Submicron Contact Printing on Silicon Using Stamp Pads.
In: Langmuir. Vol. 15 (March 1999) Issue 7 . - pp. 2398-2401.
ISSN 1520-5827
DOI: https://doi.org/10.1021/la980429s

Official URL: Volltext

Abstract in another language

Submicron scale microcontact printing of silanes onto silicon wafers is studied. Silicon microstructures are used as masters to prepare silicone rubber stamps, which are found to peel off the master easily even at wedge angles of 80\,\circ if the master has been silanized before. Stripe structures with periodicities down to 200 nm were generated. At these small scales, capillary condensation in the wedges of the stamp during the stamping process is difficult to avoid. We demonstrate a novel ``stamp pad'' technique which allows us to overcome this problem.

Further data

Item Type: Article in a journal
Refereed: Yes
Institutions of the University: Faculties > Faculty of Biology, Chemistry and Earth Sciences
Faculties > Faculty of Biology, Chemistry and Earth Sciences > Department of Chemistry
Faculties > Faculty of Biology, Chemistry and Earth Sciences > Department of Chemistry > Former Professors > Chair Physical Chemistry II - Univ.-Prof. Dr. Andreas Fery
Faculties
Faculties > Faculty of Biology, Chemistry and Earth Sciences > Department of Chemistry > Chair Physical Chemistry II
Faculties > Faculty of Biology, Chemistry and Earth Sciences > Department of Chemistry > Former Professors
Result of work at the UBT: No
DDC Subjects: 500 Science > 500 Natural sciences
500 Science > 530 Physics
500 Science > 540 Chemistry
Date Deposited: 09 Dec 2014 10:52
Last Modified: 11 Feb 2015 14:04
URI: https://eref.uni-bayreuth.de/id/eprint/4060