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New Simulation Procedure for Accurate Package Modeling Considering Chip-Package Interaction

Title data

Seler, Ernst ; Wojnowski, Maciej ; Weigel, Robert ; Hagelauer, Amélie:
New Simulation Procedure for Accurate Package Modeling Considering Chip-Package Interaction.
In: 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems. - Piscataway, NJ : IEEE , 2013 . - pp. 43-46
ISBN 978-1-4799-0707-6
DOI: https://doi.org/10.1109/EPEPS.2013.6703463

Further data

Item Type: Article in a book
Refereed: Yes
Institutions of the University: Faculties > Faculty of Engineering Science
Faculties > Faculty of Engineering Science > >
Result of work at the UBT: No
DDC Subjects: 600 Technology, medicine, applied sciences
600 Technology, medicine, applied sciences > 620 Engineering
Date Deposited: 27 Sep 2019 07:40
Last Modified: 27 Sep 2019 07:40
URI: https://eref.uni-bayreuth.de/id/eprint/52395