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Junction Temperature Measurement during Inverter Operation using a TJ-IGBT-Driver


Denk, Marco ; Bakran, Mark-M.:
Junction Temperature Measurement during Inverter Operation using a TJ-IGBT-Driver.
In: PCIM Europe 2015. - Berlin : VDE Verlag , 2015
ISBN 978-3-8007-3924-0


The junction temperature of an IGBT power module is a key parameter for its optimal operation and reliability. In recent years different sensor systems were presented for real-time TJ-measurement, but none of these solutions could prove its functionality during the real inverter operation. For the first time this paper presents an IGBT gate driver with integrated real-time TJ-measurement and investigates its properties within a working voltage source inverter. The measurement is based on the on-chip internal gate resistor RGi, whose temperature is determined by superimposing the negative gate voltage with a high-frequency identification signal. Therefore the driver consists of a small control unit that manages the entire identification process during the regular switching operation of the IGBT and calculates its junction temperature using a pre-programmed reference sensor curve. Within an automatic one-point calibration at room temperature a certain power modules can be adjusted to this sensor curve. To demonstrate the functionality of the TJ-measurement during inverter operation the driver is integrated into one phase of a voltage source inverter. The junction temperature variations that can be measured at low-frequency phase currents and during the emulation of different load-profiles show very good agreement with the temperature that is measured with an IR-camera. Thereby the so-called TJ-IGBT-Driver offers a very good temperature and time resolution of 1 K and 2.5 ms. In summary, this paper shows a working sensor system that allows real-time junction temperature measurement of conventional IGBT power modules with very good sensor properties and in a way that is suitable for series production.

Weitere Angaben

Publikationsform: Aufsatz in einem Buch
Begutachteter Beitrag: Ja
Institutionen der Universität: Fakultäten > Fakultät für Ingenieurwissenschaften > Lehrstuhl Mechatronik > Lehrstuhl Mechatronik - Univ.-Prof. Dr.-Ing. Mark-M. Bakran
Profilfelder > Emerging Fields > Energieforschung und Energietechnologie
Fakultäten > Fakultät für Ingenieurwissenschaften
Fakultäten > Fakultät für Ingenieurwissenschaften > Lehrstuhl Mechatronik
Profilfelder > Emerging Fields
Titel an der UBT entstanden: Ja
Themengebiete aus DDC: 600 Technik, Medizin, angewandte Wissenschaften > 620 Ingenieurwissenschaften
Eingestellt am: 01 Jun 2015 11:56
Letzte Änderung: 01 Jun 2015 11:56
URI: https://eref.uni-bayreuth.de/id/eprint/14477