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Dielectric properties of highly filled thermoplastics for printed circuit boards

Title data

Apeldorn, Thomas ; Keilholz, Clemens ; Wolff‐Fabris, Felipe ; Altstädt, Volker:
Dielectric properties of highly filled thermoplastics for printed circuit boards.
In: Journal of Applied Polymer Science. Vol. 128 (15 June 2013) Issue 6 . - pp. 3758-3770.
ISSN 1097-4628
DOI: https://doi.org/10.1002/app.38602

Further data

Item Type: Article in a journal
Refereed: Yes
Institutions of the University: Faculties > Faculty of Engineering Science > Chair Polymer Materials > Chair Polymer Materials - Univ.-Prof. Dr.-Ing. Volker Altstädt
Result of work at the UBT: Yes
DDC Subjects: 500 Science > 540 Chemistry
600 Technology, medicine, applied sciences > 620 Engineering
Date Deposited: 05 Oct 2020 08:20
Last Modified: 05 Oct 2020 08:20
URI: https://eref.uni-bayreuth.de/id/eprint/57833