at Google ScholarTitle data
Denk, Marco ; Bakran, Mark-M.:
Comparison of UCE- and RGi-based Junction Temperature Measurement of Multichip IGBT Power Modules.
2015
Event: EPE'15 ECCE Europe 17th European Conference on Power Electronics and Applications
, 08.-10.09.2015
, Genf, Schweiz.
(Conference item: Conference
,
Speech
)
Abstract in another language
The internal gate resistor RGi of an IGBT power module is the most promising temperature sensitive electrical parameter for real-time junction temperature measurement in a working voltage source inverter. This paper investigates RGi–based junction temperature measurement and compares it with the widespread UCE-method that is used for device characterization in laboratory setups. It is found that both methods have similar averaging properties when measuring the junction temperature of paralleled IGBT single chips. However, in case of a centered internal gate resistor the RGi-method measures a higher temperature than the area-averaging UCE-method. Especially at steep lateral temperature pro-files the RGi-measured temperature is closer to the chip peak temperature than the UCE-measured one. This deviation is investigated in thermal equilibrium and during the cooling down process using ther-mal impedance measurement, an IR-camera and a finite element simulation.
Further data
| Item Type: | Conference item (Speech) |
|---|---|
| Refereed: | Yes |
| Institutions of the University: | Faculties > Faculty of Engineering Science > Chair Mechatronics > Chair Mechatronics - Univ.-Prof. Dr.-Ing. Mark-M. Bakran Profile Fields > Emerging Fields > Energy Research and Energy Technology Faculties Faculties > Faculty of Engineering Science Faculties > Faculty of Engineering Science > Chair Mechatronics Profile Fields Profile Fields > Emerging Fields |
| Result of work at the UBT: | Yes |
| DDC Subjects: | 600 Technology, medicine, applied sciences > 620 Engineering |
| Date Deposited: | 12 Oct 2015 07:20 |
| Last Modified: | 27 Jun 2024 12:55 |
| URI: | https://eref.uni-bayreuth.de/id/eprint/20145 |