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Development of a foamed thermoplastic substrate for novel printed circuit boards

Title data

Langenfelder, D. ; Sandler, Jan K. W. ; Altstädt, Volker:
Development of a foamed thermoplastic substrate for novel printed circuit boards.
In: Radusch, Hans-Joachim (ed.): PPS-21 : Polymer Processing Society, twenty first annual meeting. - Halle-Wittenberg : Martin Luther Univ. , 2005
ISBN 3-86010-784-4

Further data

Item Type: Article in a book
Refereed: Yes
Institutions of the University: Faculties
Faculties > Faculty of Engineering Science
Faculties > Faculty of Engineering Science > Chair Polymer Materials
Faculties > Faculty of Engineering Science > Former Professors > Chair Polymer Materials - Univ.-Prof. Dr.-Ing. Volker Altstädt
Faculties > Faculty of Engineering Science > Former Professors
Result of work at the UBT: Yes
DDC Subjects: 500 Science
500 Science > 540 Chemistry
600 Technology, medicine, applied sciences
600 Technology, medicine, applied sciences > 620 Engineering
Date Deposited: 10 Aug 2020 08:42
Last Modified: 10 Aug 2020 08:42
URI: https://eref.uni-bayreuth.de/id/eprint/56385