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Electrochemical assembly of thiol-based monolayer on copper for epoxy-Cu adhesion improvement

Title data

Kwok, Stephen C. T. ; Ciucci, Francesco ; Yuen, Matthew M. F.:
Electrochemical assembly of thiol-based monolayer on copper for epoxy-Cu adhesion improvement.
In: Electrochimica Acta. Vol. 121 (2014) . - pp. 57-63.
ISSN 0013-4686
DOI: https://doi.org/10.1016/j.electacta.2013.12.146

Official URL: Volltext

Further data

Item Type: Article in a journal
Refereed: Yes
Institutions of the University: Faculties > Faculty of Engineering Science
Faculties > Faculty of Engineering Science > Professor Electrode Design of Electrochemical Energy Storage Systems > Professor Electrode Design of Electrochemical Energy Storage Systems - Univ.-Prof. Dr. Francesco Ciucci
Faculties
Faculties > Faculty of Engineering Science > Professor Electrode Design of Electrochemical Energy Storage Systems
Result of work at the UBT: No
DDC Subjects: 600 Technology, medicine, applied sciences > 620 Engineering
Date Deposited: 11 Apr 2023 06:45
Last Modified: 14 Apr 2023 06:53
URI: https://eref.uni-bayreuth.de/id/eprint/75669