Thermally Cross-Linkable Poly(p-xylylene)s for Advanced Low-Dielectric Applications

Titelangaben

Mulpuri, Syamkumar V. ; Shin, Boo-Gyo ; Bognitzki, Michael ; Greiner, Andreas ; Yoon, Do Y.:
Thermally Cross-Linkable Poly(p-xylylene)s for Advanced Low-Dielectric Applications.
In: Macromolecular Chemistry and Physics. Bd. 213 (2012) Heft 7 . - S. 705-712.
ISSN 1521-3935
DOI: https://doi.org/10.1002/macp.201100558

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Abstract

A novel series of poly(p-xylylene) homopolymer and copolymers containing thermally cross-linkable cyclohexenyl moiety are prepared via base-catalyzed Gilch route to yield high-molecular-weight polymers. The resulting polymers are highly soluble in a wide range of organic solvents and could be solution cast into flexible and transparent films. The polymers are thermally stable up to 350 degrees C and the glass transition temperature (Tg) is in the range of 136 - 250 degrees C. They undergo thermal cross-linking via the cyclohexenyl moiety. The cross-linked polymer exhibits a high Tg of 294 degrees C, a low coefficient of thermal expansion (CTE) of 45 ppm K-1. A low dielectric constant of 2.5 and a very low dielectric loss tan d of 0.0004 at 1 GHz are obtained, which are superior to conventional interconnect polymers.