Number of items: 3.
2016
Ortolino, Dominique ; Kita, Jaroslaw ; Beart, Karin ; Wurm, Roland ; Kleinewig, Saskia ; Pletsch, Andreas ; Moos, Ralf:
Failure of electrical vias manufactured in thick-film technology when loaded with short high current pulses.
In: Microelectronics Reliability.
Vol. 56
(2016)
.
- pp. 121-128.
ISSN 0026-2714
DOI: https://doi.org/10.1016/j.microrel.2015.10.011
2011
Ortolino, Dominique ; Kita, Jaroslaw ; Wurm, Roland ; Blum, Emmanuel ; Beart, Karin ; Moos, Ralf:
Investigation of the short-time high-current behavior of vias manufactured in hybrid thick-film technology.
In: Microelectronics Reliability.
Vol. 51
(2011)
Issue 7
.
- pp. 1257-1263.
ISSN 0026-2714
DOI: https://doi.org/10.1016/j.microrel.2011.02.025
2009
Nowak, Damian ; Miś, Edward ; Dziedzic, Andrzej ; Kita, Jaroslaw:
Fabrication and electrical properties of laser-shaped thick-film and LTCC microresistors.
In: Microelectronics Reliability.
Vol. 49
(2009)
Issue 6
.
- pp. 600-606.
ISSN 0026-2714
DOI: https://doi.org/10.1016/j.microrel.2009.02.019
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