Zeitschrift: Microelectronics Reliability

2016

Ortolino, Dominique ; Kita, Jaroslaw ; Beart, Karin ; Wurm, Roland ; Kleinewig, Saskia ; Pletsch, Andreas ; Moos, Ralf:
Failure of electrical vias manufactured in thick-film technology when loaded with short high current pulses.
In: Microelectronics Reliability. Bd. 56 (2016) . - S. 121-128.
ISSN 0026-2714
DOI: https://doi.org/10.1016/j.microrel.2015.10.011

2011

Ortolino, Dominique ; Kita, Jaroslaw ; Wurm, Roland ; Blum, Emmanuel ; Beart, Karin ; Moos, Ralf:
Investigation of the short-time high-current behavior of vias manufactured in hybrid thick-film technology.
In: Microelectronics Reliability. Bd. 51 (2011) Heft 7 . - S. 1257-1263.
ISSN 0026-2714
DOI: https://doi.org/10.1016/j.microrel.2011.02.025

2009

Nowak, Damian ; Miś, Edward ; Dziedzic, Andrzej ; Kita, Jaroslaw:
Fabrication and electrical properties of laser-shaped thick-film and LTCC microresistors.
In: Microelectronics Reliability. Bd. 49 (2009) Heft 6 . - S. 600-606.
ISSN 0026-2714
DOI: https://doi.org/10.1016/j.microrel.2009.02.019