Investigation of the short-time high-current behavior of vias manufactured in hybrid thick-film technology

Title data

Ortolino, Dominique ; Kita, Jaroslaw ; Wurm, Roland ; Blum, Emmanuel ; Beart, Karin ; Moos, Ralf:
Investigation of the short-time high-current behavior of vias manufactured in hybrid thick-film technology.
In: Microelectronics Reliability. Vol. 51 (2011) Issue 7 . - pp. 1257-1263.
ISSN 0026-2714
DOI: https://doi.org/10.1016/j.microrel.2011.02.025

Project information

Abstract in another language

In this contribution, the short-time high-current behavior of electrical interconnects (through-metalized vias) manufactured in thick-film technology is investigated. Such vias are reliable devices for small currents, but their behavior when high currents are applied for short times has not been fully understood. Therefore, in a four-wire-setup, short-time high-current pulses were applied to single vias and the resulting transient voltage drops were measured. Furthermore, an FEM-model was developed to simulate this voltage drops as well as the time-dependent temperature distributions inside of the vias. Input parameters were material properties and sample geometries. The good agreement between the measured and the simulated time-dependent voltage drops validated the model. The resulting temperature distributions are an appropriate engineering tool for the further development of vias with respect to reliability and high ampacity.