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Investigation of the characteristic thermal properties of IGBT power modules for robust in-situ health monitoring

Title data

Denk, Marco ; Bakran, Mark-M.:
Investigation of the characteristic thermal properties of IGBT power modules for robust in-situ health monitoring.
2016
Event: EPE 2016 ECCE Europe : 18th European Conference on Power Electronics and Applications , 5.-9.09.2016 , Karlsruhe.
(Conference item: Conference , Paper )
DOI: https://doi.org/10.1109/EPE.2016.7695291

Abstract in another language

This paper investigates the characteristic thermal properties of IGBT power modules and develops a very robust health monitoring concept to identify an aged chip-solder within a voltage source inverter. It is shown that at an optimum excitation frequency the power module structure enables a selective identification of an increased thermal chip-solder resistance Rth, 1 with a maximum Rth, 1 measuring sensitivity. These outstanding features of the thermal power module structure were investigated in the frequency domain and verified by experimental measurements with artificially aged power modules.

Further data

Item Type: Conference item (Paper)
Refereed: Yes
Institutions of the University: Faculties > Faculty of Engineering Science > Chair Mechatronics > Chair Mechatronics - Univ.-Prof. Dr.-Ing. Mark-M. Bakran
Profile Fields > Advanced Fields > Advanced Materials
Profile Fields > Emerging Fields > Energy Research and Energy Technology
Research Institutions > Research Units > ZET - Zentrum für Energietechnik
Faculties
Faculties > Faculty of Engineering Science
Faculties > Faculty of Engineering Science > Chair Mechatronics
Profile Fields
Profile Fields > Advanced Fields
Profile Fields > Emerging Fields
Research Institutions
Research Institutions > Research Units
Result of work at the UBT: Yes
DDC Subjects: 600 Technology, medicine, applied sciences > 620 Engineering
Date Deposited: 11 Nov 2016 06:54
Last Modified: 11 Nov 2016 06:54
URI: https://eref.uni-bayreuth.de/id/eprint/35110