Influence of the power semiconductor packaging on the failure characteristic for safety-critical applications

Titelangaben

Gleißner, Michael ; Bakran, Mark-M.:
Influence of the power semiconductor packaging on the failure characteristic for safety-critical applications.
2017
Veranstaltung: PCIM Europe 2017 , 16.-18.05.2017 , Nürnberg, Deutschland.
(Veranstaltungsbeitrag: Kongress/Konferenz/Symposium/Tagung , Paper )

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Abstract

The packaging of power semiconductors determines their failure characteristic. Wire-bonded modules fail with an undefined state reaching from not ideal short-circuit to explosion of the module depending on the failure energy. In contrast, an ideal short-on failure characteristic is known for presspack and sandwich structure modules. Safety critical applications like the discharging of energy sources, e.g. fuel cells, require an ideal short-on failure characteristic. A minimum failure energy is necessary to reach this ideal failure state and a maximum failure energy must not be exceeded in order to avoid severe mechanical destruction. Therefore, the failure characteristic depending on packaging and energy is investigated by destruction tests.