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Co-simulation and Co-design of Chip-Package-Board Interfaces in Highly-Integrated RF Systems

Title data

Issakov, Vadim ; Wojnowski, Maciej ; Knapp, Herbert ; Trotta, Saverio ; Forstner, Hans-Peter ; Pressel, Klaus ; Hagelauer, Amelie:
Co-simulation and Co-design of Chip-Package-Board Interfaces in Highly-Integrated RF Systems.
In: 2016 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM). - Piscataway, NJ : IEEE , 2016 . - pp. 94-101
ISBN 978-1-5090-0484-3
DOI: https://doi.org/10.1109/BCTM.2016.7738959

Abstract in another language

The level of integration for RF and mm-wave systems is continuously increasing. Highly-integrated system on chip solutions have to be encapsulated in a package and assembled on a board. In addition, to be more attractive as a product, the trend goes towards further integration of passives and antennas in a package. This drives the system in package solutions. However, electrical properties of the package and board may have a significant effect on system parameters, especially at high frequencies. Hence, layout features of package and board must be carefully modelled and considered during the design. Furthermore, it is often insufficient to model chip, package and board separately, as some high-frequency effects may not be captured. An example is electromagnetic coupling between integrated coils on chip and routing traces in package. In this paper we describe considerations on co-simulation and co-design of highlyintegrated RF systems by means of accurate electromagnetic modelling. We demonstrate the approach and various aspects of chip-package-board co-design based on examples of systems for various applications: 6 GHz VCO using embedded inductor; backhaul communication system in package for V-band and Eband and a four-channel 77 GHz automotive radar transceiver in a package with four dipole antennas.

Further data

Item Type: Article in a book
Refereed: Yes
Institutions of the University: Faculties > Faculty of Engineering Science > >
Result of work at the UBT: No
DDC Subjects: 600 Technology, medicine, applied sciences > 620 Engineering
Date Deposited: 01 Oct 2019 07:35
Last Modified: 01 Oct 2019 07:35
URI: https://eref.uni-bayreuth.de/id/eprint/52474