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Wafer Level Package Integrated Antenna Concepts for Circular Polarization

Title data

Schmidbauer, Philipp ; Wojnowski, Maciej ; Weigel, Robert ; Hagelauer, Amelie:
Wafer Level Package Integrated Antenna Concepts for Circular Polarization.
In: IEEE Conference on Electrical Performance of Electronic Packaging and Systems : Proceedings. - San Jose, USA , 2018 . - pp. 285-287
ISBN 978-1-5386-5166-7
DOI: https://doi.org/10.1109/EPEPS.2018.8534303

Abstract in another language

We prove design concepts for embedded wafer level ball grid array package integrated circularly polarized antennas in the 57 GHz to 64 GHz ISM band. Therefore, we propose performance requirements and evaluate the properties of four different antenna-in-package layouts based on electromagnetic full-wave simulations with focus on the axial ratio characteristic

Further data

Item Type: Article in a book
Refereed: Yes
Keywords: ball grid arrays; electromagnetic wave polarisation; millimetre wave antennas; wafer level packaging; antenna-in-package layouts; ISM band; electromagnetic full-wave simulations; axial ratio characteristics; circularly polarized antennas; embedded wafer level ball grid array package; design concepts; circular polarization; wafer level package integrated antenna concepts; frequency 57 GHz to 64 GHz; Patch antennas; Bandwidth; Polarization; Antenna feeds; Layout; antenna-in-package; mm-wave packaging; heterogeneous integration
Institutions of the University: Faculties > Faculty of Engineering Science > >
Result of work at the UBT: No
DDC Subjects: 600 Technology, medicine, applied sciences > 620 Engineering
Date Deposited: 16 Oct 2019 07:37
Last Modified: 16 Oct 2019 07:37
URI: https://eref.uni-bayreuth.de/id/eprint/52703