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Recent Trends in Wafer-Level Package Technology

Title data

Schmidbauer, Philipp ; Wojnowski, Maciej ; Pressel, Klaus ; Weigel, Robert ; Hagelauer, Amelie:
Recent Trends in Wafer-Level Package Technology.
In: 2020 IEEE MTT-S International Wireless Symposium (IWS). - Shanghai , 2020
ISBN 978-1-7281-6703-9
DOI: https://doi.org/10.1109/IWS49314.2020.9360140

Official URL: Volltext

Abstract in another language

The fast growing market for system-in-package (SiP) solutions goes along with the continous evolution of important integration platforms such as the embedded wafer-level ball grid array (eWLB) package. In this article, we highlight three important design trends for eWLB technology: Diversified antenna-in-package (AiP) concepts, massive off-chip circuitry and a modularized toolbox design approach. We show, how those trends are driven by novel application fields in various areas.

Further data

Item Type: Article in a book
Refereed: Yes
Keywords: eWLB; Heterogeneous integration; SiP Wireless communication; Market research; Antennas; Electronics packaging
Institutions of the University: Faculties > Faculty of Engineering Science > Chair Communication Electronics > Chair Communication Electronics - Univ.-Prof. Dr.-Ing. Amélie Marietta Hagelauer
Result of work at the UBT: No
DDC Subjects: 600 Technology, medicine, applied sciences > 620 Engineering
Date Deposited: 30 Mar 2021 06:59
Last Modified: 30 Mar 2021 06:59
URI: https://eref.uni-bayreuth.de/id/eprint/64454