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Gleißner, Michael ; Schilling, Oliver ; Bakran, Mark-M.:
Perceptibility comparison of degraded thermal parameters of a power module by junction temperature measurement via the internal gate resistance and forward voltage.
2021
Veranstaltung: 23rd European Conference on Power Electronics and Applications (EPE'21 ECCE Europe)
, 06.-10. Sept. 2021
, Virtual.
(Veranstaltungsbeitrag: Kongress/Konferenz/Symposium/Tagung
,
Paper
)
Abstract
The thermal impedance of power modules is an end-of-life indicator because it increases due to material degradation. It can be determined by measurement of the junction temperature based on sensitive electrical parameters like the internal gate resistor or the forward voltage. The different results of both measurement methods concerning the temperature measurement position are shown for power cycled single-chip IGBT modules with homogeneous and inhomogeneous temperature distribution.