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Perceptibility comparison of degraded thermal parameters of a power module by junction temperature measurement via the internal gate resistance and forward voltage

Title data

Gleißner, Michael ; Schilling, Oliver ; Bakran, Mark-M.:
Perceptibility comparison of degraded thermal parameters of a power module by junction temperature measurement via the internal gate resistance and forward voltage.
2021
Event: 23rd European Conference on Power Electronics and Applications (EPE'21 ECCE Europe) , 06.-10. Sept. 2021 , Virtual.
(Conference item: Conference , Paper )

Abstract in another language

The thermal impedance of power modules is an end-of-life indicator because it increases due to material degradation. It can be determined by measurement of the junction temperature based on sensitive electrical parameters like the internal gate resistor or the forward voltage. The different results of both measurement methods concerning the temperature measurement position are shown for power cycled single-chip IGBT modules with homogeneous and inhomogeneous temperature distribution.

Further data

Item Type: Conference item (Paper)
Refereed: Yes
Additional notes: ISBN 978-9-0758-1537-5
Institutions of the University: Faculties > Faculty of Engineering Science > Chair Mechatronics > Chair Mechatronics - Univ.-Prof. Dr.-Ing. Mark-M. Bakran
Profile Fields > Advanced Fields > Advanced Materials
Profile Fields > Emerging Fields > Energy Research and Energy Technology
Research Institutions > Research Units > ZET - Zentrum für Energietechnik
Result of work at the UBT: Yes
DDC Subjects: 600 Technology, medicine, applied sciences > 620 Engineering
Date Deposited: 22 Feb 2022 08:42
Last Modified: 22 Feb 2022 08:42
URI: https://eref.uni-bayreuth.de/id/eprint/68722