at Google ScholarTitle data
Denk, Marco ; Bakran, Mark-M.:
Investigation of the characteristic thermal properties of IGBT power modules for robust in-situ health monitoring.
2016
Event: EPE 2016 ECCE Europe 18th European Conference on Power Electronics and Applications
, 5.-9.9.2016
, Karlsruhe.
(Conference item: Conference
,
Paper
)
DOI: https://doi.org/10.1109/EPE.2016.7695291
Abstract in another language
This paper investigates the characteristic thermal properties of IGBT power modules and develops a very robust health monitoring concept to identify an aged chip-solder within a voltage source inverter. It is shown that at an optimum excitation frequency the power module structure enables a selective identification of an increased thermal chip-solder resistance Rth, 1 with a maximum Rth, 1 measuring sensitivity. These outstanding features of the thermal power module structure were investigated in the frequency domain and verified by experimental measurements with artificially aged power modules.
Further data
| Item Type: | Conference item (Paper) |
|---|---|
| Refereed: | Yes |
| Institutions of the University: | Faculties > Faculty of Engineering Science > Chair Mechatronics > Chair Mechatronics - Univ.-Prof. Dr.-Ing. Mark-M. Bakran Profile Fields > Advanced Fields > Advanced Materials Profile Fields > Emerging Fields > Energy Research and Energy Technology Research Institutions > Research Units > Zentrum für Energietechnik - ZET Faculties Faculties > Faculty of Engineering Science Faculties > Faculty of Engineering Science > Chair Mechatronics Profile Fields Profile Fields > Advanced Fields Profile Fields > Emerging Fields Research Institutions Research Institutions > Research Units |
| Result of work at the UBT: | Yes |
| DDC Subjects: | 600 Technology, medicine, applied sciences > 620 Engineering |
| Date Deposited: | 11 Nov 2016 06:54 |
| Last Modified: | 27 Jun 2024 13:16 |
| URI: | https://eref.uni-bayreuth.de/id/eprint/35110 |