at Google ScholarTitle data
Schmidbauer, Philipp ; Wojnowski, Maciej ; Pressel, Klaus ; Weigel, Robert ; Hagelauer, Amelie:
Recent Trends in Wafer-Level Package Technology.
In:
2020 IEEE MTT-S International Wireless Symposium (IWS). -
Shanghai
,
2020
ISBN 978-1-7281-6703-9
DOI: https://doi.org/10.1109/IWS49314.2020.9360140
Abstract in another language
The fast growing market for system-in-package (SiP) solutions goes along with the continous evolution of important integration platforms such as the embedded wafer-level ball grid array (eWLB) package. In this article, we highlight three important design trends for eWLB technology: Diversified antenna-in-package (AiP) concepts, massive off-chip circuitry and a modularized toolbox design approach. We show, how those trends are driven by novel application fields in various areas.
Further data
| Item Type: | Article in a book |
|---|---|
| Refereed: | Yes |
| Keywords: | eWLB; Heterogeneous integration; SiP Wireless communication; Market research; Antennas; Electronics packaging |
| Institutions of the University: | Faculties > Faculty of Engineering Science > Former Professors > Chair Communication Electronics - Univ.-Prof. Dr.-Ing. Amélie Marietta Hagelauer Faculties Faculties > Faculty of Engineering Science Faculties > Faculty of Engineering Science > Chair Communication Electronics Faculties > Faculty of Engineering Science > Former Professors |
| Result of work at the UBT: | No |
| DDC Subjects: | 600 Technology, medicine, applied sciences > 620 Engineering |
| Date Deposited: | 30 Mar 2021 06:59 |
| Last Modified: | 30 Mar 2021 06:59 |
| URI: | https://eref.uni-bayreuth.de/id/eprint/64454 |