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Applicability of thermal impedance spectroscopy via gate voltage variation for IGBTs and SiC MOSFETs

Title data

Gleißner, Michael ; Soller, Florian ; Bakran, Mark-M.:
Applicability of thermal impedance spectroscopy via gate voltage variation for IGBTs and SiC MOSFETs.
2024
Event: ECCE Europe 2024 , 02.09.-06.09.2024 , Darmstadt.
(Conference item: Conference , Paper )
DOI: https://doi.org/10.1109/ECCEEurope62508.2024.10751962

Abstract in another language

This article investigates which junction temperature swings arise from minimal sinusoidal superposition of the gate voltage in the on-state for IGBT and SiC MOSFET semiconductors. For this purpose, a simulation model is created based on extensive curve tracer measurements and validated by temperature measurements with different types of sensors in a laboratory experiment. The thermal impedance can be determined by temperature swings at different frequencies. Based on these findings, the feasibility of degradation detection during load cycles is investigated.

Further data

Item Type: Conference item (Paper)
Refereed: Yes
Keywords: junction temperature; temperature measurement; semiconductor device measurements; impedance spectroscopy; degradation diagnosis
Institutions of the University: Faculties > Faculty of Engineering Science > Chair Mechatronics > Chair Mechatronics - Univ.-Prof. Dr.-Ing. Mark-M. Bakran
Profile Fields > Advanced Fields > Advanced Materials
Profile Fields > Emerging Fields > Energy Research and Energy Technology
Research Institutions > Research Units > Zentrum für Energietechnik - ZET
Result of work at the UBT: Yes
DDC Subjects: 600 Technology, medicine, applied sciences > 620 Engineering
Date Deposited: 22 Nov 2024 06:30
Last Modified: 22 Nov 2024 06:30
URI: https://eref.uni-bayreuth.de/id/eprint/91226