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Integrated Systems-in-Package : Heterogeneous Integration of Millimeter-Wave Active Circuits and Passives in Fan-Out Wafer-Level Packaging Technologies

Title data

Hagelauer, Amelie ; Wojnowski, Maciej ; Pressel, Klaus ; Weigel, Robert ; Kissinger, Dietmar:
Integrated Systems-in-Package : Heterogeneous Integration of Millimeter-Wave Active Circuits and Passives in Fan-Out Wafer-Level Packaging Technologies.
In: IEEE Microwave Magazine. Vol. 19 (2018) Issue 1 . - pp. 48-56.
ISSN 1527-3342
DOI: https://doi.org/10.1109/MMM.2017.2759558

Further data

Item Type: Article in a journal
Refereed: Yes
Keywords: Antenna measurements; Dipole antennas; Integrated circuits; Packaging; Radio frequency; Silicon; Transceivers
Institutions of the University: Faculties > Faculty of Engineering Science > >
Result of work at the UBT: No
DDC Subjects: 600 Technology, medicine, applied sciences > 620 Engineering
Date Deposited: 16 Oct 2019 06:44
Last Modified: 16 Oct 2019 06:44
URI: https://eref.uni-bayreuth.de/id/eprint/52657