Investigation of non-symmetric contacting and voids in electrical vias produced in hybrid thick-film technology

Title data

Ortolino, Dominique ; Kita, Jaroslaw ; Wurm, Roland ; Blum, Emmanuel ; Beart, Karin ; Moos, Ralf:
Investigation of non-symmetric contacting and voids in electrical vias produced in hybrid thick-film technology.
2011
Event: 35th International Microelectronics and Packaging IMAPS Conference , 21. - 24.09.2011 , Gdansk, Poland.
(Conference item: Conference , Poster )

Project information

Abstract in another language

Hybrid-thick-film circuits consist of many different components. There are screen-printed passive elements (conductors, resistors, electrical vias), SMDs and active elements like transistors or ICs. Whereas most of passive components are well investigated and described, the electrical vias remain unattended. This contribution deals with the behavior of thick-film vias when applying high currents, since resistive heating caused by a high current might lead to the destruction of the vias. In order to investigate the influence of non-radial-symmetric contacting and geometric irregularities of the vias, a 3D FEM-model was developed. The contacting of the vias was modeled including geometric irregularities (voids). Both are resulting in a non-symmetric temperature distribution T(x,t) in the via and furthermore in higher maximum temperatures after a defined current pulse. Finally, the influence of the position of geometric irregularities according to the contacting was investigated.