High Temperature Thermosets With a Low Coefficient of Thermal Expansion

Titelangaben

Wippl, Johann ; Schmidt, Hans-Werner ; Giesa, Reiner:
High Temperature Thermosets With a Low Coefficient of Thermal Expansion.
In: Macromolecular Materials and Engineering. Bd. 290 (2005) Heft 7 . - S. 657-668.
ISSN 1439-2054
DOI: https://doi.org/10.1002/mame.200500120

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Abstract

Polymeric thermosetting composites can be used as metal substitutes for certain applications if they possess high temperature stability in air, low coefficient of thermal expansion (CTE), and sufficient flexural strength, in combination with competitive costs. Commercial bismaleimide, bisnadimide, and cyanate ester thermosetting materials were selected due to their excellent thermal stability. Low CTEs were achieved by adding high loading levels of fused silica or silicon nitride fillers. Several optimized composites were fabricated by varying the materials, composition, and cure conditions. Characteristic composite properties, such as CTE, thermal stability, glass transition temperature (Tg), flexural strength, and filler distribution were investigated. The best system developed consists of Matrimide 5292, a commercial two-component bismaleimide resin, filled with 75% Silbond FW100EST, and additionally reinforced with 0.5% Twaron short fibers. This composite is distinguished by a CTE around 15 ppm/K, a Tg around 340 C, flexural strength above 100 MPa, and attractive material costs.