at Google ScholarTitle data
Seler, Ernst ; Wojnowski, Maciej ; Weigel, Robert ; Hagelauer, Amelie:
New Simulation Procedure for Accurate Package Modeling Considering Chip-Package Interaction.
In:
2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems. -
Piscataway, NJ
: IEEE
,
2013
. - pp. 43-46
ISBN 978-1-4799-0707-6
DOI: https://doi.org/10.1109/EPEPS.2013.6703463
Further data
| Item Type: | Article in a book |
|---|---|
| Refereed: | Yes |
| Institutions of the University: | Faculties > Faculty of Engineering Science Faculties > Faculty of Engineering Science > Former Professors > Chair Communication Electronics - Univ.-Prof. Dr.-Ing. Amélie Marietta Hagelauer Faculties Faculties > Faculty of Engineering Science > Chair Communication Electronics Faculties > Faculty of Engineering Science > Former Professors |
| Result of work at the UBT: | No |
| DDC Subjects: | 600 Technology, medicine, applied sciences 600 Technology, medicine, applied sciences > 620 Engineering |
| Date Deposited: | 27 Sep 2019 07:40 |
| Last Modified: | 14 Jul 2020 11:17 |
| URI: | https://eref.uni-bayreuth.de/id/eprint/52395 |