at Google ScholarTitle data
Hagelauer, Amelie ; Wojnowski, Maciej ; Pressel, Klaus ; Weigel, Robert ; Kissinger, Dietmar:
Integrated Systems-in-Package : Heterogeneous Integration of Millimeter-Wave Active Circuits and Passives in Fan-Out Wafer-Level Packaging Technologies.
In: IEEE Microwave Magazine.
Vol. 19
(2018)
Issue 1
.
- pp. 48-56.
ISSN 1527-3342
DOI: https://doi.org/10.1109/MMM.2017.2759558
Further data
| Item Type: | Article in a journal |
|---|---|
| Refereed: | Yes |
| Keywords: | Antenna measurements; Dipole antennas; Integrated circuits; Packaging; Radio frequency; Silicon; Transceivers |
| Institutions of the University: | Faculties > Faculty of Engineering Science > Former Professors > Chair Communication Electronics - Univ.-Prof. Dr.-Ing. Amélie Marietta Hagelauer Faculties Faculties > Faculty of Engineering Science Faculties > Faculty of Engineering Science > Chair Communication Electronics Faculties > Faculty of Engineering Science > Former Professors |
| Result of work at the UBT: | No |
| DDC Subjects: | 600 Technology, medicine, applied sciences > 620 Engineering |
| Date Deposited: | 16 Oct 2019 06:44 |
| Last Modified: | 14 Jul 2020 11:30 |
| URI: | https://eref.uni-bayreuth.de/id/eprint/52657 |