at Google ScholarTitle data
Gleißner, Michael ; Naumann, Moritz:
Reduction of thermal stress by means of a non-linear thermal capacitance close to the chip.
2025
Event: ECCE Europe 2025
, 31.08.25-04.09.25
, Birmingham.
(Conference item: Conference
,
Paper
)
Abstract in another language
A simple liquid-filled container above the power semiconductor chip increases the thermal capacitance in a certain time range at higher power levels, thereby minimizing the thermal impedance by about 25%. Measurements on a hardware prototype with a periodic load profile at different time constants show that the temperature swing can be reduced, significantly improving lifetime. A simple, one-dimensional network model is presented to reproduce this non-linear, temperature-dependent behavior of the thermal impedance for simulations.
Index Terms—two-phase cooling, thermal behavior, thermal cycling, thermal model, thermal design.
Further data
| Item Type: | Conference item (Paper) |
|---|---|
| Refereed: | Yes |
| Institutions of the University: | Faculties > Faculty of Engineering Science > Chair Mechatronics > Chair Mechatronics - Univ.-Prof. Dr.-Ing. Mark-M. Bakran Profile Fields > Advanced Fields > Advanced Materials Profile Fields > Emerging Fields > Energy Research and Energy Technology Research Institutions > Research Units > Zentrum für Energietechnik - ZET |
| Result of work at the UBT: | Yes |
| DDC Subjects: | 600 Technology, medicine, applied sciences > 620 Engineering |
| Date Deposited: | 01 Dec 2025 14:37 |
| Last Modified: | 01 Dec 2025 14:37 |
| URI: | https://eref.uni-bayreuth.de/id/eprint/95359 |