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Thick-Film and LTCC Microcapacitors

Title data

Miś, Edward ; Dziedzic, Andrzej ; Piasecki, Tomasz ; Kita, Jaroslaw ; Moos, Ralf:
Thick-Film and LTCC Microcapacitors.
2007
Event: 31. International Conference of the International Microelectronics and Packaging Society , 23.-26.09.2007 , Rzeszów-Krasiczyn, Poland.
(Conference item: Conference , Other Presentation type)

Abstract in another language

Capacitors are frequently used in electronic circuits. Thick-film technology allows fabrication of such components in the case of small and medium capacitance values. They can be also manufactured in LTCC structures. Sandwich and interdigitated planar capacitors were fabricated on alumina or LTCC substrates. Various dielectric inks and electrodes materials were used. Samples properties were investigated in a wide frequency and temperature range. Results were related with technology and discussed.

Further data

Item Type: Conference item (Other)
Refereed: Yes
Institutions of the University: Faculties > Faculty of Engineering Science
Faculties > Faculty of Engineering Science > Chair Functional Materials > Chair Functional Materials - Univ.-Prof. Dr.-Ing. Ralf Moos
Faculties
Faculties > Faculty of Engineering Science > Chair Functional Materials
Profile Fields > Advanced Fields > Advanced Materials
Research Institutions > Research Centres > Bayreuth Center for Material Science and Engineering - BayMAT
Profile Fields
Profile Fields > Advanced Fields
Research Institutions
Research Institutions > Research Centres
Result of work at the UBT: Yes
DDC Subjects: 600 Technology, medicine, applied sciences > 620 Engineering
Date Deposited: 08 Jun 2015 07:02
Last Modified: 06 Apr 2016 07:30
URI: https://eref.uni-bayreuth.de/id/eprint/14838