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Laser Processing of Materials for MCM-C Applications

Title data

Kita, Jaroslaw ; Gollner, Egmont ; Moos, Ralf:
Laser Processing of Materials for MCM-C Applications.
Event: 2nd Electronic System-Integration Technology Conference : ESTC 2008 , 01.-04.09.2008 , London, Großbritannien.
(Conference item: Conference , Speech )

Official URL: Volltext

Abstract in another language

Application of lasers for MCM-C (ceramic multichip modules) technology offers an opportunity to miniaturize passive elements as well as whole substrates. At present, the laser processed thick-film conductive lines can be as small as 20 mum. Processing of unfired LTCC tapes allows achieving hot-plate beams with widths of 250 mum. To realize such fine structures by laser cutting, some understanding of the nature of interaction of the laser beam with the material is necessary. Application of different laser types for microelectronic packaging was discussed earlier, e.g. in. In most cases however, Nd:YAG lasers were mainly applied for patterning PCBs, polymers, or silicon wafers, whereas for fired ceramics CO2-lasers were used. This paper discusses some phenomena that occur during processing of materials used in MCM-C applications: thick-film layers, fired and unfired ceramics with frequency-tripled Nd:YAG laser.

Further data

Item Type: Conference item (Speech)
Refereed: Yes
Institutions of the University: Faculties > Faculty of Engineering Science
Faculties > Faculty of Engineering Science > Chair Functional Materials > Chair Functional Materials - Univ.-Prof. Dr.-Ing. Ralf Moos
Faculties > Faculty of Engineering Science > Chair Functional Materials
Profile Fields > Advanced Fields > Advanced Materials
Research Institutions > Research Centres > Bayreuth Center for Material Science and Engineering - BayMAT
Profile Fields
Profile Fields > Advanced Fields
Research Institutions
Research Institutions > Research Centres
Result of work at the UBT: Yes
DDC Subjects: 600 Technology, medicine, applied sciences > 620 Engineering
Date Deposited: 27 Apr 2015 13:55
Last Modified: 06 Apr 2016 09:18