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DSC-Chip in LTCC Technology – Feasibility Study

Titelangaben

Kita, Jaroslaw ; Missal, Wjatscheslaw ; Wappler, Eberhard ; Moos, Ralf:
DSC-Chip in LTCC Technology – Feasibility Study.
2010
Veranstaltung: 34th International Microelectronics and Packaging IMAPS Conference , 22.-25.09.2010 , Wrocław, Poland.
(Veranstaltungsbeitrag: Kongress/Konferenz/Symposium/Tagung , Sonstige Präsentationstyp)

Abstract

Differential Scanning Calorimetry (DSC) is a wide-spread and well-known method for the detection of phase transitions (for example glass transition, crystallization or melting) and the determination of melting enthalpies of different materials like polymers, glasses or some metal alloys. Typical DSCgadgetry are quite expensive due to their complexity and each measurement causes additional costs. Due to possible contamination of the furnace, typical DSC-equipment does not allow to analyze all materials. DSC-devices are designed as stationary laboratory equipment and their mobile application for a fast and in-situ analysis is impossible. Therefore, our idea is a novel design of a DSC-Chip where furnace, temperature sensors as well as sample crucible and a reference are completely integrated into one ceramic structure. Thanks to the unusual vertical placement of temperature sensors, the chip can be small and compact. Moreover, overall costs of DSC-Analysis can be drastically reduced. For that purpose, the most suitable technology seems to be Low Temperature Co-fired Ceramics (LTCC). LTCC allow to reduce power consumption and structure dimensions. Easy patterning of unfired tapes allows designing ceramic substrates with three-dimensional elements. Due to the multilayer setup, integration of heater and temperature sensors inside the monolithic ceramic is possible. This paper presents results of feasibility study and preliminary results of our novel LTCC-DSC-Chip. At first, a simplified FEM-Model was developed with the objective of proving of our assumptions and designing the chip. The chip itself was made in LTCC-Technology using non-shrinkage tapes and typical thick-film pastes. Our first DSC-tests with indium as reference material showed ability to detect melting peaks at specified temperature with promising accuracy. Another tests with variable sample amount confirmed usability of developed structure for fast DSC-analysis. After a calibration, melting enthalpies can be determined.

Weitere Angaben

Publikationsform: Veranstaltungsbeitrag (Sonstige)
Begutachteter Beitrag: Ja
Institutionen der Universität: Fakultäten > Fakultät für Ingenieurwissenschaften
Fakultäten > Fakultät für Ingenieurwissenschaften > Lehrstuhl Funktionsmaterialien > Lehrstuhl Funktionsmaterialien - Univ.-Prof. Dr.-Ing. Ralf Moos
Fakultäten
Fakultäten > Fakultät für Ingenieurwissenschaften > Lehrstuhl Funktionsmaterialien
Profilfelder > Advanced Fields > Neue Materialien
Forschungseinrichtungen > Forschungszentren > Bayreuther Materialzentrum - BayMAT
Profilfelder
Profilfelder > Advanced Fields
Forschungseinrichtungen
Forschungseinrichtungen > Forschungszentren
Titel an der UBT entstanden: Ja
Themengebiete aus DDC: 600 Technik, Medizin, angewandte Wissenschaften > 620 Ingenieurwissenschaften
Eingestellt am: 26 Mai 2015 11:39
Letzte Änderung: 12 Apr 2016 06:59
URI: https://eref.uni-bayreuth.de/id/eprint/14217