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DSC-Chip in LTCC Technology – Feasibility Study

Title data

Kita, Jaroslaw ; Missal, Wjatscheslaw ; Wappler, Eberhard ; Moos, Ralf:
DSC-Chip in LTCC Technology – Feasibility Study.
Event: 34th International Microelectronics and Packaging IMAPS Conference , 22.-25.09.2010 , Wrocław, Poland.
(Conference item: Conference , Other Presentation type)

Abstract in another language

Differential Scanning Calorimetry (DSC) is a wide-spread and well-known method for the detection of phase transitions (for example glass transition, crystallization or melting) and the determination of melting enthalpies of different materials like polymers, glasses or some metal alloys. Typical DSCgadgetry are quite expensive due to their complexity and each measurement causes additional costs. Due to possible contamination of the furnace, typical DSC-equipment does not allow to analyze all materials. DSC-devices are designed as stationary laboratory equipment and their mobile application for a fast and in-situ analysis is impossible. Therefore, our idea is a novel design of a DSC-Chip where furnace, temperature sensors as well as sample crucible and a reference are completely integrated into one ceramic structure. Thanks to the unusual vertical placement of temperature sensors, the chip can be small and compact. Moreover, overall costs of DSC-Analysis can be drastically reduced. For that purpose, the most suitable technology seems to be Low Temperature Co-fired Ceramics (LTCC). LTCC allow to reduce power consumption and structure dimensions. Easy patterning of unfired tapes allows designing ceramic substrates with three-dimensional elements. Due to the multilayer setup, integration of heater and temperature sensors inside the monolithic ceramic is possible. This paper presents results of feasibility study and preliminary results of our novel LTCC-DSC-Chip. At first, a simplified FEM-Model was developed with the objective of proving of our assumptions and designing the chip. The chip itself was made in LTCC-Technology using non-shrinkage tapes and typical thick-film pastes. Our first DSC-tests with indium as reference material showed ability to detect melting peaks at specified temperature with promising accuracy. Another tests with variable sample amount confirmed usability of developed structure for fast DSC-analysis. After a calibration, melting enthalpies can be determined.

Further data

Item Type: Conference item (Other)
Refereed: Yes
Institutions of the University: Faculties > Faculty of Engineering Science
Faculties > Faculty of Engineering Science > Chair Functional Materials > Chair Functional Materials - Univ.-Prof. Dr.-Ing. Ralf Moos
Faculties > Faculty of Engineering Science > Chair Functional Materials
Profile Fields > Advanced Fields > Advanced Materials
Research Institutions > Research Centres > Bayreuth Center for Material Science and Engineering - BayMAT
Profile Fields
Profile Fields > Advanced Fields
Research Institutions
Research Institutions > Research Centres
Result of work at the UBT: Yes
DDC Subjects: 600 Technology, medicine, applied sciences > 620 Engineering
Date Deposited: 26 May 2015 11:39
Last Modified: 12 Apr 2016 06:59