at Google ScholarTitle data
Miś, Edward ; Dziedzic, Andrzej ; Piasecki, Tomasz ; Kita, Jaroslaw ; Moos, Ralf:
Thick-Film and LTCC Microcapacitors.
2007
Event: 31. International Conference of the International Microelectronics and Packaging Society
, 23.-26.09.2007
, Rzeszów-Krasiczyn, Poland.
(Conference item: Conference
,
Other
Presentation type)
Abstract in another language
Capacitors are frequently used in electronic circuits. Thick-film technology allows fabrication of such components in the case of small and medium capacitance values. They can be also manufactured in LTCC structures. Sandwich and interdigitated planar capacitors were fabricated on alumina or LTCC substrates. Various dielectric inks and electrodes materials were used. Samples properties were investigated in a wide frequency and temperature range. Results were related with technology and discussed.
Further data
| Item Type: | Conference item (Other) |
|---|---|
| Refereed: | Yes |
| Institutions of the University: | Faculties > Faculty of Engineering Science Faculties > Faculty of Engineering Science > Chair Functional Materials > Chair Functional Materials - Univ.-Prof. Dr.-Ing. Ralf Moos Faculties Faculties > Faculty of Engineering Science > Chair Functional Materials Profile Fields > Advanced Fields > Advanced Materials Research Institutions > Research Centres > Bayreuth Center for Material Science and Engineering - BayMAT Profile Fields Profile Fields > Advanced Fields Research Institutions Research Institutions > Research Centres |
| Result of work at the UBT: | Yes |
| DDC Subjects: | 600 Technology, medicine, applied sciences > 620 Engineering |
| Date Deposited: | 08 Jun 2015 07:02 |
| Last Modified: | 06 Apr 2016 07:30 |
| URI: | https://eref.uni-bayreuth.de/id/eprint/14838 |