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Stöcker, Thomas ; Exner, Jörg ; Schubert, Michael ; Moos, Ralf:
Thermoelectric properties of copper based oxide materials processed with the novel aerosol deposition method.
2016
Veranstaltung: 6th International Congress on Ceramics (ICC6)
, 21.-25.08.2016
, Dresden, Deutschland.
(Veranstaltungsbeitrag: Kongress/Konferenz/Symposium/Tagung
,
Poster
)
Abstract
In the field of thermoelectric energy conversion, oxide materials show a promising potential due to their good stability in oxidizing environments. While Delafossite materials, i.e. CuFeO2, exhibit a good thermoelectric performance as p-type material, the spinel CuFe2O4 is of interest as n-type semiconductor at elevated temperatures. In this study, the thermoelectric properties of copper based oxide materials processed with the novel, cost-effective Aerosol Deposition (AD) coating technique were investigated. This technology bases upon a room temperature impact consolidation process (RTIC) to deposit dense solid films of ceramic materials on various substrates without using a high-temperature step during the coating process. By employing this AD method, it was possible to measure the Seebeck coefficient and the electrical conductivity of ceramic films of several microns up to 900 °C under different oxygen partial pressures. The aerosol deposited films were high-temperature stable and showed neither secondary phases nor delamination under temperature cycling. Our measurements demonstrate the successful employment of the novel Aerosol Deposition method to fabricate dense and crack-free ceramic layers of copper based thermoelectrics at room temperature with no further heat treatment. The good thermoelectric properties and the high temperature stability could make this new cost-effective process accessible for the production of inexpensive thermoelectric modules for high temperature applications.