Aerosol Deposition Method vs. Screen-Printing Technique : Novel Manufacturing Process for NTCR Thermistor Devices

Titelangaben

Bruckner, Michaela ; Kita, Jaroslaw ; Münch, Christian ; Moos, Ralf:
Aerosol Deposition Method vs. Screen-Printing Technique : Novel Manufacturing Process for NTCR Thermistor Devices.
2017
Veranstaltung: 41th International Microelectronics and Packaging IMAPS Conference , 11. - 13.09.2017 , Warsaw, Poland.
(Veranstaltungsbeitrag: Kongress/Konferenz/Symposium/Tagung , Vortrag )

Weitere URLs

Angaben zu Projekten

Abstract

This study compares spinel-based NTC resistors made by classical screen-printing technique and NTCR devices manufactured by the novel Aerosol Deposition Method (ADM). The ADM is a novel technique to deposit dense ceramic layers directly from a ceramic powder at room temperature. The investigated structures had a typical chip size of 1206 with screen-printed interdigital electrodes. The structures were electrically characterized and the typical NTCR parameters r25 and B were calculated. The obtained results are discussed and possible application of ADM to manufacture NTC resistors with regard to the further application as precise temperature sensors are evaluated.